X-ray Inspection System is a nuclear instrument used in the fields of physics, electronics and communication technology.
It uses the different arrangement and combination of material atoms (which can be understood as density) to absorb and reflect light differently, and the light and dark degrees of the projected image map provide technicians with a long-term and stable basis. This is another non-destructive testing method. Ultrasonic testing of equipment cannot be done.
The manufacturer of X-ray Inspection System tells you that for the defect detection of large-size electronic modules and the demand for product quality control in the electronics industry, it solves the key scientific problems of three-dimensional layered imaging and realizes high-quality soldering of electronic module packaging, printed circuit boards, and high-seal packaging. Precision automatic non-destructive testing will be applied to product identification and evaluation, destructive physical analysis (DPA), product process quality identification, etc. of various equipment electronics systems. X-ray Inspection System manufacturers tell you that it can be used in the development and production of equipment In the process of equipment development, identify defects caused by product design, process design, and material introduction, such as PCB hole breaks, solder joint pillow effects, cracks, BGA device solder ball defects, and structural damage. Improve the quality and reliability of electronic products, improve the level of product development and design and manufacturing technology, and enhance the ability to identify and analyze defects in electronic products.